MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device, in which mounting area is reduced, cost reduction is attained and gradation in the alignment precision of dicing is eliminated. SOLUTION: A substrate, in which a first and a second insulating substrate 22, 23 are stacked, is prepared. The substrate has a large number of mounting parts 20. Reference marks 42 are formed on the surface of the first insulating substrate 22, and parts of the second insulating substrate 23 on the reference marks 42 are opened. Semiconductor chips 33 are mounted on the respective mounting parts 20 and are covered with a resin layer. By using the reference marks 42 as alignment reference, the respective mounting parts 20 are subjected to dicing and separated into individual semiconductor devices.