| 摘要 |
PROBLEM TO BE SOLVED: To prevent stripping of interface between a metal substrate and an insulating film by forming a substrate for a thermoelectric module through formation of irregularities on the surface of the metal substrate, forming the insulating film on the metal substrate, and then forming electrodes on the insulating film. SOLUTION: The irregularities are formed on the surface 3 of a metal substrate 2 by sand blasting chemical etching. On the uneven surface 3 of the metal substrate 2, an Al2O3 film is formed as an insulating film 4. Using a mask, a Cu frame coating film is formed as electrodes 6 in the electrode formation scheduled region on the insulating film 4. Thus, a substrate 1 for a thermoelectric module is formed. When this method, stripping of an interface between the metal substrate 2, and the insulating film 4 can be prevented even if thermal stresses such as a thermal cycling or thermal shocks act on the substrate 1.
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