| 摘要 |
PURPOSE: A copper foil for a printed circuit board is provided to improve an etching property, prevent a grey spot from being generated to gain a clean substrate surface, remove a undercut phenomenon in an etching process, prevent an adhesion force by permeation of a hydrochloric acid from being reduced. improve a physical property such as thermostability, property enduring hydrochloric acid, and property enduring the boiling, and, always, keep a strong adhesion force. CONSTITUTION: A copper foil for a printed circuit board has a Ni-Mn-Mo gilt layer comprising Mn(1.5-7.0%) and Mo(0.05-1.05% ) as a weight % to Ni on the one side of a copper foil, and a layer processed with a chromate on the one side or both sides of the Ni-Mn-Mo gilt layer.
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