发明名称 |
AUTOMATIC SYSTEM AND METHOD FOR CUTTING AND CLASSIFYING WORKPIECE |
摘要 |
<p>PURPOSE: An automatic system and method for cutting and classifying a workpiece is provided to simplify a cutting process of a substrate and a classifying process of a cut workpiece, thereby decreasing the fabrication cost and process time. CONSTITUTION: An automatic cutting and classifying system comprises: a substrate cutting unit for cutting a substrate having a plurality of cells including a defective cell into a plurality of unit substrates; and an unloader for loading the cut unit substrate onto a cassette depending on a mode. To control the system, an operation mode for the unit substrate is determined. The unit substrates are classified by the determined operation mode and thereafter are unloaded onto a cassette. The determining and classifying steps are repeatedly performed with respect to all of the unit substrates.</p> |
申请公布号 |
KR20000033838(A) |
申请公布日期 |
2000.06.15 |
申请号 |
KR19980050882 |
申请日期 |
1998.11.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BYEON, SEONG JUN;AN, JONG BEOM;HEO, MIN YEONG |
分类号 |
B26D7/18;B07C5/00;B26D7/27;B28D5/00;G02F1/13;G02F1/1333;G02F1/136;G05B19/418;(IPC1-7):G02F1/13 |
主分类号 |
B26D7/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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