| 摘要 |
PURPOSE: A device for identifying tension in an outer-clamped circular saw. CONSTITUTION: A device for identifying tension added to a saw blade(11a) on a disc(11) composing a circular saw of a wafer processing unit for cutting a wafer, comprises an excitor(31) disposed to cause free vibration to one portion of the disc(11); a load sensor(32) for sensing strength of the vibration at an adjacent region to the excitor(31); a plurality of displacement sensors(33) for sensing displacement of the vibration on the saw blade(11a) of the disc(11); and a signal analyzing unit(34) for identifying tension by receiving a signal from the load sensor(32) and the displacement sensor(33), and by using a mode parameter or a frequency transmission function. Accordingly, it is rapidly precisely judged whether the circular saw used for a semiconductor wafer cutter has uniform tension, which results in improved productivity.
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