发明名称 REPRODUCING SYSTEM FOR ABRASIVE SLURRY
摘要 <p>PROBLEM TO BE SOLVED: To automatically provide a stable reproduced abrasive slurry by detecting pH value, zeta potential, and particle size distribution of waste abrasive slurry used in a polishing machine, adjusting optimal value based on the detected pH value, zeta potential, and particle size distribution. SOLUTION: A waste abrasive slurry supplied to a reproducive abrasive slurry tank 1 is discharged from a pump 2, fine foreign matters are removed by a filter 3, and then pH value, zeta potential, and particle size distribution of the waste abrasive slurry are respectively measured by a pH meter 4, a zeta potential meter 5, and particle size distribution meter 6. These measurement signals are fed into a control device 7. The control device 7 adjusts the particle size distribution in the waste abrasive slurry to an optimal value, by adding alkaline components from alkaline component supply means 8, pure water from a pure water supply means 9, and new abrasive slurry from an abrasive slurry supply means 10, to the reproductive abrasive slurry tank 1, based on each of the measured values.</p>
申请公布号 JP2000158343(A) 申请公布日期 2000.06.13
申请号 JP19980339063 申请日期 1998.11.30
申请人 MITSUBISHI MATERIALS SILICON CORP 发明人 OSADA TATSUYA;KURODA YUKIO
分类号 B24B57/02;H01L21/304;(IPC1-7):B24B57/02 主分类号 B24B57/02
代理机构 代理人
主权项
地址