| 发明名称 |
Composition for resin sealing a semiconductor device, resin sealed semiconductor device and method of manufacturing the same |
| 摘要 |
A composition (20) for sealing a semiconductor device (10) contains polyphenylene sulfide wherein a line expansion coefficient at 150 DEG C to 200 DEG C is 4.75 x 10<-5> Ä1/ DEG CÜ or less, a line thermal expansion coefficient at 80 to 130 DEG C is 6.0 x 10<-5> Ä1/ DEG CÜ or less, and a line expansion coefficient ratio between the flow direction and a normal direction of the flow direction is 0.55 or more. <IMAGE> |
| 申请公布号 |
EP1006575(A2) |
申请公布日期 |
2000.06.07 |
| 申请号 |
EP19990123922 |
申请日期 |
1999.12.02 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ADACHI, MASAKI;YAMAMURA, MEGUMI |
| 分类号 |
H01S5/022;C09K3/10;H01L21/56;H01L23/29;H01L23/31;H01L31/02;H01L31/0203;H01L31/173 |
主分类号 |
H01S5/022 |
| 代理机构 |
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代理人 |
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