| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing carrier having mechanical strength, being excellent in a thickness accuracy and surface smoothness and causing no heavy metal pollution by constituting the polishing carrier by laminating plural prepreg plates composed of mutually parallel carbon fibers. SOLUTION: A double-side polishing device for polishing the double sides of a disk-shaped work such as a semiconductor wafer polishes the upper/lower surfaces of the work placed between rotary surface plates by stretching polishing cloth on the opposed surfaces of a pair of upper/lower rotary surface plates. A carrier is a disk-shaped member thinner than the work to hold the work between the surface plates. A circular (or quadrangular) work holding hole for holding the work is formed in the carrier. The carrier is formed of a plate member 1a by laminating the prescribed number of prepreg plates 4 formed by parallelly juxtaposing plural carbon fibers 3. Here, the carbon fibers are superposed so that the directions of the carbon fibers 3 of the adjacent prepreg plates 4 cross at a righ angle to each other, and an adhesive is applied between the respective prepreg plates 4. |
