| 摘要 |
PURPOSE: A method and a device for inspecting is provided to effectively examine the form and the contacted state of a bonding wire by processing the form of the bonding wire three-dimensionally. CONSTITUTION: A lead frame of the same size with a standard lead frame is loaded in an X-Y transporting device(10) to inspect the lead frame of semi-product state. The X-Y transporting device(10) is moved for a dividing area of a first memorized position to be in a photographing area according to memorized positional information. The focus of a camera(30) is adjusted in a photographing part by a control device(50). Therefore, the automatic focus control of the camera(30) is performed. If a bonding wire decided to be fine by observing the state of the bonding wire through a screen showed on a monitor(30), a passing button(74) of an input device(70) is pushed. If the inspection for the lead frame is finished, the inspection is finished, but if not, the inspection is performed through the same process by moving the next memorized part into the photographing area of the camera(30).
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