| 摘要 |
PURPOSE: A carrier tape for a semiconductor package is provided to repress damage on the lead of the semiconductor package while being carried or managed. CONSTITUTION: A carrier tape for a semiconductor package is composed of a carrier tape band(100) made of polymer material, a pocket(102) formed for storing the semiconductor package, a center hole(104) formed on the floor of the pocket, a supporter(106), a wall(108) in the shape of a bridge of nose, and a sprocket hole(110). Therefore, a tool is prepared for locating the carrier tape band on the tool. Then, the carrier tape band is heated at a temperature of 180-210°C for being softened, and the carrier tape band is shaped in a press forming method, a vacuum forming method, or an air blowing forming method.
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