| 摘要 |
PROBLEM TO BE SOLVED: To prevent films which have adhered to inner walls of a container for a semiconductor processing apparatus, from adhering to a wafer due to the film getting peeled off from the inner walls. SOLUTION: A chamber 10, which is a container for a semiconductor processing apparatus, comprises a shield 1 constituting the outer walls of a vacuum chamber 9, and insulating members 5a and 5b attached to the shield 1. The chamber 10 is used for a sputtering system, and a target 3 is attached to the member 5a and a wafer 4 to a table 6 near the member 5b. Electrostatic attracting force generating means 11 includes a plurality of small electrodes 2 and a power source 8 for applying a positive voltage to one of and a negative voltage to the other of every two adjacent small electrodes 2. An electrostatic attracting force generated by the means 11 adsorbs films adhered to the inner walls of the shield 1 and particles within the chamber 10 to the inner walls of the shield 1.
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