| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting property by preventing warp of a molded main body part of a plastic molded type semiconductor device. SOLUTION: This semiconductor device consists of a tab retaining a semiconductor chip, a molded main body part 2 which is formed by resin-sealing the semiconductor chip, a mold protruding part 2a protruded from the molded main body part 2 to the direction opposite to a chip retaining side of the tab, inner leads which are arranged stretching to the periphery of the semiconductor chip, bonding wires electrically connecting pads of the semiconductor chip with the corresponding inner leads, and a plurality of outer leads 5 protruded from the molded main body 2. The mold protruding part 2a is formed on the back side 2c of the molded main body 2, so that warp of the molded main body 2 is prevented. |
