| 摘要 |
PROBLEM TO BE SOLVED: To lessen a CSP in manufacturing cost by reducing it in material cost and number of processes and to protect a semiconductor chip against a mechanical shock as much as possible, where the CSP is a semiconductor device which is manufactured through a CSP[chip size package] technique and where a polyimide tape is utilized as an intermediate board used for providing outer terminals. SOLUTION: A polyimide tape 4 is composed of polyimide layers 4a and 4c and a conductive layer 4b sandwiched in between the polyimide layers 4a and 4b, and a semiconductor chip 2 is electrically connected to outer terminals 6 through the intermediary of the polyimide tape 4. The outer terminals 6 connected to the conductive layer 4b are provided to the one surface of the tape 4, and the pads 2a of the semiconductor chip 2 are electrically connected to the conductive layer 4b through solders 10 on the other surface of the tape 4. A whole space through which the semiconductor chip 2 and the polyimide tape 4 confront each other is filled up with resin 12. In this structure, an elastic adhesive layer (elastomer) can be dispensed with, and a solder connection is utilized, so that a high-frequency thermocompression bonding process is not required. |
