MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To easily change a gap between a semiconductor chip and a lead in a manufacturing apparatus of a LOC-type semiconductor device. SOLUTION: A manufacturing apparatus of a LOC-type semiconductor device has an assembly stage 20 for fixing a semiconductor chip 11 to a lead 12 having an inner lead 12a extending on the main surface of the semiconductor chip 11 with an adhesive 13. The assembly stage 20 is constituted by a chip holding part 21A for holding the semiconductor chip 11 on its bottom surface, a lead holding part 22A arranged at the side of the chip holding part 21A and holding the lead 12 with a spacing 14 between the main surface of the semiconductor chip 11 and the lead 12, and a spacing adjusting part 23 made of plural thin plates 23a removably placed on the holding surface of the lead holding part 22A.