发明名称 LEAD FRAME PLATING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a plating device to achieve the partial plating while continuously carrying a lead frame bar in which no plating leak is generated from a rear side. SOLUTION: A surface opposite to a surface to be plated of a lead frame 110 is pressed by a pressing 130 to press a lead frame against a masking jig side 120, and only a specified part of the lead frame is plated in a condition where the lead frame is closely attached to the masking jig. The pressing jig presses a belt 131 against the lead frame side by a backup plate 135, the belt is provided with a hollow part 132 of the specified width along the longitudinal direction of the belt with compressed air contained inside, the masking jig side is formed of an elastic (flexible) substance such as rubber, and the elastic substance on the masking jig side presses the lead frame against the masking jig side by the compressed air in the belt so as to be closely attached to the lead frame.</p>
申请公布号 JP2000144485(A) 申请公布日期 2000.05.26
申请号 JP19980315193 申请日期 1998.11.05
申请人 DAINIPPON PRINTING CO LTD 发明人 ITO HISATOSHI;KOTANI KEIICHI
分类号 H01L23/50;C25D5/02;C25D5/08;C25D7/00;(IPC1-7):C25D7/00 主分类号 H01L23/50
代理机构 代理人
主权项
地址