DEVICE FOR COOLING WAFER TO DETECT TEMPERATURE IN HSG PROCESS FACILITY

摘要

PURPOSE: A device for cooling a wafer while detecting temperature in an HSG process facility is provided to adjust cooling time by detecting the temperature of the surface of the wafer for preventing process error caused by loading the wafer not completely cooled to a carrier. CONSTITUTION: A sensor(24) for detecting temperature is installed near the surface of a wafer in a cooling chamber(20) for detecting the temperature of the surface of the wafer and for transferring to a system controller(30). Then, the system controller decides the completion of the cooling for the wafer in case of the temperature of the wafer lower than a certain temperature for generating a second controlling signal(CS2). And then, a pump(28) starts a pumping operation according to the second controlling signal generated from the system controller. Therefore, argon gas injected inside of the cooling chamber for cooling the wafer is pumped to outside to maintain the high vacuum state of the cooling chamber.