发明名称 METHOD AND DEVICE FOR EXPOSING A SUBSTRATE TO LIGHT
摘要 The invention relates to a method for exposing a substrate (1) to light, whereby said substrate is provided with a resist system (2) and a conductive connection is established between a ground potential and the substrate (1) and/or at least one of the layers S1-Sn of the resist system (2). The invention further relates to a device for carrying out said method. According to the invention, the tip of a contact K1 is pushed through to layer S1 by means of spring elements E1-E4, the tip of a contact K2 is pushed through layer S1 to layer S2, a tip of a contact K3 is pushed through layers S1 and S2 to S3 etc. in a single step. The electric charges from layer S1 are conveyed to the ground potential via the tip of a contact K3; the charges from layer S2 are conveyed via the tip of a contact K2 etc. and/or from the substrate (1) via the tip of a contact K4.
申请公布号 WO0030146(A1) 申请公布日期 2000.05.25
申请号 WO1999DE03639 申请日期 1999.11.16
申请人 LEICA MICROSYSTEMS LITHOGRAPHY GMBH;HAHMANN, PETER;BEYER, DIRK;KRAUHS, DOROTHEE;ELSTER, THOMAS 发明人 HAHMANN, PETER;BEYER, DIRK;KRAUHS, DOROTHEE;ELSTER, THOMAS
分类号 G03F7/20;H01J37/02;H01J37/20;H01J37/305;H01J37/317;H01L21/027 主分类号 G03F7/20
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