发明名称 |
MICROINJECTING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a microinjecting device which is enhanced in bonding strength between a protecting film and a heating chamber barrier layer and is remarkably improved in total printing performance. SOLUTION: A bonding promotion layer 20 is formed to an entire face of a protecting film 2 to be in touch with a heating layer 11, an electrode layer 3 and a heating chamber barrier layer 5 thereby improving a contact force between the protecting film 2 and the heating chamber barrier layer 5. A working solution is accordingly prevented from leaking outside and an insulating function of the protecting film 2 is prevented from being lowered. Moreover, a temperature resistance and a moisture resistance of the heating chamber barrier layer 5 are improved and a total thickness distribution of the heating chamber barrier layer 5 is uniformed.
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申请公布号 |
JP2000141657(A) |
申请公布日期 |
2000.05.23 |
申请号 |
JP19990314407 |
申请日期 |
1999.11.04 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
AHN BYUNG-SUN;NIKOLAEVICH DUNAEV BORIS;ZUKOV ANDREY ALEKSANDROVICH |
分类号 |
B41J2/045;B41J2/055;B41J2/14;B41J2/16;(IPC1-7):B41J2/045 |
主分类号 |
B41J2/045 |
代理机构 |
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主权项 |
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地址 |
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