发明名称 MICROINJECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a microinjecting device which is enhanced in bonding strength between a protecting film and a heating chamber barrier layer and is remarkably improved in total printing performance. SOLUTION: A bonding promotion layer 20 is formed to an entire face of a protecting film 2 to be in touch with a heating layer 11, an electrode layer 3 and a heating chamber barrier layer 5 thereby improving a contact force between the protecting film 2 and the heating chamber barrier layer 5. A working solution is accordingly prevented from leaking outside and an insulating function of the protecting film 2 is prevented from being lowered. Moreover, a temperature resistance and a moisture resistance of the heating chamber barrier layer 5 are improved and a total thickness distribution of the heating chamber barrier layer 5 is uniformed.
申请公布号 JP2000141657(A) 申请公布日期 2000.05.23
申请号 JP19990314407 申请日期 1999.11.04
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 AHN BYUNG-SUN;NIKOLAEVICH DUNAEV BORIS;ZUKOV ANDREY ALEKSANDROVICH
分类号 B41J2/045;B41J2/055;B41J2/14;B41J2/16;(IPC1-7):B41J2/045 主分类号 B41J2/045
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