发明名称 |
Direct chip attach for low alpha emission interconnect system |
摘要 |
An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process. |
申请公布号 |
SG72751(A1) |
申请公布日期 |
2000.05.23 |
申请号 |
SG19970002768 |
申请日期 |
1997.08.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BROUILLETTE GUY PAUL;DANOVITCH DAVID HIRSCH;LIEHR MICHAEL;MOTSIFF WILLIAM THOMAS;ROLDAN JUDITH MARIE;SAMBUCETTI CARLOS JUAN;SARAF, RAVI, F. |
分类号 |
H01L21/60;H01L23/556;H05K1/18;H05K3/24;H05K3/32;H05K3/34;(IPC1-7):H01L21/44;H01L21/98 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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