发明名称 CONDUCTOR PASTE, CERAMIC MULTILAYER BOARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductor paste, wherein protrusions, cracks, ceramic cracks and the like are hardly generated after simultaneous calcination of the paste with a low-temperature sintered ceramic green sheet. SOLUTION: Conductor pastes 14 consisting of conductor powder and an organic vehicle is formed by mixing respectively 60.0 to 80.0 wt.% of copper oxide powder and 20.0 to 40.0 wt.% of copper powder with the conductor powder. Or the paste is formed by mixing respectively 55.0 to 79.5 wt.% of copper oxide powder, 20.0 to 40.0 wt.% of copper powder and 0.5 to 5.0 wt.% of at least one kind of metallic powder chosen from among a group consisting of a nickel oxide, palladium and tungsten with the conductor powder.
申请公布号 JP2000138309(A) 申请公布日期 2000.05.16
申请号 JP19980308491 申请日期 1998.10.29
申请人 MURATA MFG CO LTD 发明人 BANDAI HARUFUMI;TANI KOJI;SUGO KIMIHIDE
分类号 B23K35/22;B23K35/30;H01L23/12;H01L23/15;H05K1/09;H05K1/11;H05K3/46;(IPC1-7):H01L23/12 主分类号 B23K35/22
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