| 摘要 |
PROBLEM TO BE SOLVED: To improve the practicability of a wiring board by omitting a bonded integral configuration by means of an adhesive, to reduce environmental issues, and to transmit high-speed signals without further degrading electric characteristics, particularly, the signals. SOLUTION: A wiring board is provided with a core wiring board 9 carrying wiring patterns 7a and 7b formed on at least one main surface of an insulating layer 6 made of a liquid crystal polymer. The wiring board is also provided with insulating coating layers 8a and 8b which are integrated with the surfaces of the wiring board 9 on which the wiring pattern 7a and 7b are formed, have bored holes for exposing required portions 10a and 10b of the pattern 7a and 7b, and are made of the liquid crystal polymer. |
