| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste suitable for a through hole filling paste and also provide a circuit board together with its manufacturing method, wherein surface smoothness is assured without raising cost. SOLUTION: An insulating layer 2 is formed on both surfaces of a glass epoxy substrate 1. At the glass epoxy substrate 1, a through hole 4 is formed which is filled with a conductive paste 5. The conductive paste 5 comprises a metal filler and resin content. For a curing agent of the conductive paste 5, a boric acid block-type amine compound is selected based on an aging stability (viscosity, hygroscopicity), with two kinds of resin, especially, of different curing characteristics used. Thus, using a temporary curing and polishing, etc., in a post step, the substrate surface can be planarized, resulting in improved yield after polishing.
|
