发明名称 |
Process for three dimensional inspection of electronic components |
摘要 |
A three dimensional inspection process for ball array devices. The ball array device is positioned in a fixed optical system. The ball array device is illuminated and a first image of the ball array device is taken with a first camera disposed in a fixed focus position relative to the ball array device to obtain a characteristic circular doughnut shape image from a ball. A second image of the ball array device is taken with a second camera disposed in a fixed focus position relative to the ball array device to obtain a top surface image of the ball. The first image and the second image are processed using a triangulation method to calculate a three dimensional position of the ball with reference to a pre-calculated calibration plane.
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申请公布号 |
US6064757(A) |
申请公布日期 |
2000.05.16 |
申请号 |
US19990321805 |
申请日期 |
1999.05.28 |
申请人 |
BEATY, ELWIN M. |
发明人 |
BEATY, ELWIN M.;MORK, DAVID P. |
分类号 |
G01B11/24;G01B11/245;G01N21/956;G06T1/00;G06T7/00;H05K13/08;(IPC1-7):G06K9/00 |
主分类号 |
G01B11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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