| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor element is mounted on a wiring board without causing design change of the wiring board, when the shape of the semiconductor element is changed and without applying large load on wire. SOLUTION: A semiconductor device 1 is provided with a wiring board 2, a semiconductor element 3 and wires 4. A die pad 5 is arranged on the wiring board 2, and a plurality of bonding pads 6 are arranged in parallel around the die pad 5. Each of the bonding pads 6 has two pad parts 9, which are arranged rectilinearly in the direction of the vias 7, and a connecting part 10 which connects a part between the pad parts 9 so as to be capable of easily cutting the part. A plurality of dummy pads 11 are arranged at almost uniform intervals between the die pad 5 and the bonding pads 6. The semiconductor element 3 is bonded to the die pad 5 and connected with the bonding pads 6 with the wires 4. This connection is performed directly or via the dummy pads 11, according to a distance between the semiconductor element 3 and the bonding pads 6. |
