| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a bumped electronic part at a low cost by using conductive paste to realize bump junction of a low connection resistance, and also to provide a mounted body. SOLUTION: In the bumped electronic part mounting method by which an electronic part having gold bumps is mounted on a substrate 1 with use of conductive paste, a gold film 3 is formed on surfaces of electrodes 2 of the substrate 1 by flush plating, and then contaminated layers 3a on the surfaces of the gold film 3 are subjected to a plasma process to be removed by reverse sputtering. Thereafter, the electronic part having the metal bumps formed thereon is mounted on the substrate 1 to be connected with the electrodes 2 with the conductive paste disposed therebetween. As a result, the mounting can be realized with a low connection resistance and a low cost with use of the conductive paste. Because of no use of any solder, lead pollution after the part is discarded can be avoided.
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