| 摘要 |
PROBLEM TO BE SOLVED: To realize multilayer wiring which has high reliability. SOLUTION: This device 100 contains a first wiring layer 20, an interlayer insulating layer 30 formed on the first wiring layer 20, a second wiring layer 60 formed on the interlayer insulating layer 30, a plurality of through-holes 40 for connecting the first wiring layer 20 and the second wiring layer 60, and contact layers 50 formed in the plurality of through-holes 40. At least one of the through-hole 40 is so constituted that at least one part of the first wiring layer 20 is eliminated, and the bottom surface is a continuous surface constituted of a surface 30a of the interlayer insulating layer and a surface 20a of the first wiring layer. |
