| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a product, and at the same time to quickly change a socket assembly by retaining an IC module in a chamber being heated under test conditions, and by transporting a carrier one step at a time for heating and transferring it to the side of a test site. SOLUTION: On the upper surface of the lower plate of a chamber, a fitting piece 6, where a plurality of fitting grooves 6a in which a carrier 5 where an IC module is retained can be placed are formed, is mounted. At a specific side of the fitting piece 6, a bottom dead center is mounted lower than the upper surface of the fitting piece 6, and a movable piece 9, where a fitting groove 9a with the same interval as that of the fitting groove 6a is formed and elevation and advance/retreat movement are made, is positioned. A movable piece elevation means, consisting of a cylinder and an elevation plate 13, raises and lowers the movable piece 9 so that the upper surface of the movable piece 9 becomes higher than and lower than the upper surface of the fitting piece 6. A movable piece advance/retreat means consisting of a stepping motor and a ball screw causes the movable piece 9 to be subjected to the advance/retreat movement by one pitch of the fitting groove 9a at a time.
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