发明名称 ULTRASONIC BONDING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide an ultrasonic bonding method to improve a connecting strength. SOLUTION: The ultrasonic bonding method has the step of bonding a first resin component 3 formed with a pin 5 to a second resin component 4 formed with a hole 6 to be inserted with the pin 5 by using an ultrasonic horn 1 for transmitting an ultrasonic vibration. In this case, the method comprises a step of positioning the component 3 with the component 4 by inserting the pin 5 into the hole 6 and a step of bonding the component 3 to the component 4 by both melting and caulking the pin 5 and ultrasonic welding at a pin periphery 7. The melting, the caulking and the welding may be simultaneously or sequentially executed with any first.</p>
申请公布号 JP2000127248(A) 申请公布日期 2000.05.09
申请号 JP19980301176 申请日期 1998.10.22
申请人 TOYOTA MOTOR CORP 发明人 MIURA MORIMICHI
分类号 B23K20/10;B29C65/08;B29C65/56;(IPC1-7):B29C65/08 主分类号 B23K20/10
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