| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free material which is capable of dropping its melting point to the temperature at which electronic parts can be assembled, and excellent in mechanical strength and wettability by adding Ag, Bi and Cu in a specified range with Sn as the basic composition. SOLUTION: A Sn-Ag-Bi-Cu soldering material contains Sn which is a basic composition, 0.1-20 wt.% Ag, 0.1-25% Bi and 0.1-3.0 wt.% Cu. Further, 0.1-20 wt.% In can be added to the above composition. Alternatively, the soldering material is an alloy containing Sn and Sb, which are basic compositions, and 0.1-20 wt.% Sb. The alloy contains at least one kind of 0.1-30 wt.% Bi and 0.1-20 wt.% In, and at need, at least one kind of 0.1-3.0 wt.% Cu and 0.1-15 wt.% Zn, and the balance Sn.
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