| 发明名称 |
Method for forming bumps using dummy wafer |
| 摘要 |
A method for forming bumps including the steps of forming bumps on a dummy wafer. The dummy wafer is diced into dummy chips and the bumps formed on the dummy chips are inspected. Thus only good bumps are transferred to a real chip on which circuit patterns are formed.
|
| 申请公布号 |
US6057168(A) |
申请公布日期 |
2000.05.02 |
| 申请号 |
US19990237897 |
申请日期 |
1999.01.27 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
SEYAMA, KIYOTAKA;OTA, HIDEKI;USUI, YASUHIRO;SATOH, KAZUAKI |
| 分类号 |
H01L21/60;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
