| 发明名称 |
Method of making an electronic component using reworkable underfill encapsulants |
| 摘要 |
A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.
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| 申请公布号 |
US6057381(A) |
申请公布日期 |
2000.05.02 |
| 申请号 |
US19980110080 |
申请日期 |
1998.07.02 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
MA, BODAN;TONG, QUINN K.;XIAO, CHAODONG |
| 分类号 |
H01L21/50;C08F2/48;C08F283/00;C08F283/12;C08F290/14;C08F299/02;C08G18/28;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):H01L21/00;H01L21/44;H01L21/48;C08F2/46;H02G3/08 |
主分类号 |
H01L21/50 |
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