| 摘要 |
PROBLEM TO BE SOLVED: To improve performance and reliability of a semiconductor device by providing a semiconductor chip at a specified position in a device frame, bonding a plurality of ribbons to a specified position in the device frame, and fixing the semiconductor chip. SOLUTION: A device frame comprising a base 1 and a frame 2 is formed of a resin ceramic, etc., with a long chip 8 mounted on a surface 5 of the device frame. A plurality of flexible ribbons 6 are bonded at a specified position in the device frame, and both end parts of the long chip 8 are fixed to an internal lead 4 with the ribbons 6. An electrode of the chip 8 and the internal lead 4 are connected with a bonding wire 9. Thus, the semiconductor chip 8 is correctly mounted to improve the performance and reliability of a semiconductor device. |
