| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of ball height inspection by deciding that the height of an electrode is abnormal, when the distance from the electrode of electronic components to a regression plane is equal to or more than a preset reference value. SOLUTION: A component-retaining device samples the height data of the entire bottom surface of electronic component by a three-dimensional image pickup device. In image processing, information on the diameter of a ball is used and a template for expressing a ball shape is created. Then, the template is compared with an image which is being picked up, the center coordinates of each ball are obtained, the height of the ball at each ball center is measured from a three-dimensional image, and a regression plane is calculated. Height from a regression plane 20 is examined, in comparison with lower-limit and upper-limit values f1 and f2 in the tolerance of height from the regression plane 20 which is given in advance for all balls, thus improving inspection reliability. |
