| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for mounting bumped electronic components, which can ensure its mounting position accuracy. SOLUTION: This apparatus, for mounting a bumped electronic component P on a substrate in a positioning section by picking up the electronic component from a supply section with the use of a transfer head 9, includes a line camera 15 disposed between the supply and positioning sections for recognizing an outer contour shape of the electronic component, an area camera 16 disposed therebetween for recognizing bumps of the electronic component, and a coating section 13 for coating flux on the bump, and is designed to find beforehand a relative positional relationship between the component P and the bumps prior to flux coating, re-recognize only the outer contour shape of the electronic part after coating, and estimates the position of the bumps, based on the known relative position relationship. Thereby the apparatus can estimate a new positional shifts caused by the flux coating and can ensure a positional accuracy at mounting of the components. |
