| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of cracks or the like in the jointing material such as solder that joints terminal members and the main body of an electronic component due to the difference in thermal expansion coefficient between the them, and to suppress ESR of the electronic component to a low level. SOLUTION: A metallic plate constituting terminal members 9 has an at least two-layered structure comprising a layer of a first metal, having thermal expansion coefficient of equal or close to that of a ceramic material, and a layer of a second metal of low electrical resistivity. For example, a clad metal is used in which either a first layer 12 or a second layer 13 is constituted of a first metal, and the other layer is constituted of a second metal. The thermal expansion coefficient of the layer constituted of the first metal is in the range of 1×10-6/ deg.C-1.5×10-5/ deg.C, and the electrical resistivity of the layer constituted of the second metal is at most 10×Ω.cm.
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