| 摘要 |
PROBLEM TO BE SOLVED: To avoid exposing bonding wires to the outside of a mold package by bending the top end of a support lead fixed to a semiconductor chip so as to be higher than the bonding wire's position. SOLUTION: The top end 71 of a support lead 7 is bent so as to be higher than the height of a gold wire 4 previously set in a wire bonding step and a semiconductor chip 1 is supported. The semiconductor chip 1, inner leads 2 and the support lead 7 are adhered with insulation tapes 3, 31 to fix the chip 1 to a lead frame. The semiconductor chip 1 and the inner leads 2 are wire-bonded through the gold wires 4 at a predetermined height and sealed with a mold resin 6. Thus the top end 71 of the support lead 7 is bent so as to be higher than the position of the gold wire 4 and hence if the semiconductor chip shifts, the exposure of the gold wire 4 to the outside of a package can be prevented. |
