| 摘要 |
PROBLEM TO BE SOLVED: To avoid stripping, etc., due to the temp. change and obtain a heat radiating member suited for chilling a semiconductor element capable of keeping a high radiation characteristic for a long time, by constituting the surface of a plate from a heat conductive layer formed by bonding carbon fibers with a bond. SOLUTION: The heat radiating member 1 has plate-like parts 2 for conducting and radiating the heat which are disposed with specified spacings and bonded to a heating body 3. The plate-like parts 2 are integrated through couplers 4 and bonded to the heating body 3 through adhesives, etc. The plate- like parts 2 have a heat conductive layer 2a formed like a plate by bonding carbon fibers 5 with a bond. The carbon fibers 5 are pref. pitch type carbon fibers from which plate-like parts 2 having a high thermal conductivity and a low thermal expansion coefficient can be obtd. Thus, a heat radiating member having a high radiation property can be obtd., without giving a stress due to the thermal expansion difference to a heating body such as semiconductors, semiconductor packages, etc., this enabling the use of a highly integrated semiconductor.
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