发明名称 |
Manufacture method for micromechanical devices |
摘要 |
A process for manufacturing micromechanical devices. The process includes the step of covering the activation circuitry (201) and those parts of the device that come in contact with moving parts with a pad film (202). The pad film prevents frictional wear and sticking of the moving parts, and can prevent electrical shorts between different parts of the activation circuitry. Additionally, the pad film can prevent particulates from interfering with the operation of the device.
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申请公布号 |
US6053617(A) |
申请公布日期 |
2000.04.25 |
申请号 |
US19940311480 |
申请日期 |
1994.09.23 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
KAERIYAMA, TOSHIYUKI |
分类号 |
G02B26/08;(IPC1-7):G02B7/182 |
主分类号 |
G02B26/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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