| 摘要 |
PROBLEM TO BE SOLVED: To obtain a copolymer polyimide film useful for a substrate for a metal wiring circuit board having a high modulus of elasticity, a low coefficient of thermal expansion, a low water absorption, etc., by adding an imide conversion agent to a specific copolymerized polyamic acid, forming the copolymerized polyamic acid into a film and heat-treating the film. SOLUTION: A copolymerized polyamic acid of four components (blocks) composed of 10-90 mol%, preferably 20-90 mol% based on dianhydride of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, 10-90 mol%, preferably 10-80 mol% pyromellitic acid dianhydride, 10-90 mol%, preferably 10-70 mol% based on diamine of p-phenylenediamine and 10-90 mol%, preferably 30-90 mol% of bisaminophenoxyphenylpropane is mixed with an imide conversion agent, made into a film to give a copolymerized polyamic acid-copolymerized polyimide gel film, which is heat-treated to give a copolymerized polyimide film. A metal wiring circuit is formed on the surface of the film to give a metal wiring circuit board. |
