SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PURPOSE: A substrate processing apparatus is provided to reduce an entire size and a processing time by eliminating a cooling unit which performs a cooling process before coating of a resist. CONSTITUTION: A process part(3) performs a process with respect to a wafer substrate. A delivery part(2) delivers in/out a substrate carrier(C) in which plural substrates are contained and maintained. A substrate convey part(4) takes out a substrate from the substrate carrier(C) delivered in the delivery part(2) and hands over the substrate to the process part(3) before processing, and takes over a processed substrate from the process part(3) and hands over the substrate in the substrate carrier(C). A transport part changes positions of the substrate carrier(C) between a first and a second positions.