| 摘要 |
PURPOSE: A multi-layered wire structure and a method for fabricating thereof are provided to improve the reliability of connection between a filling layer and a wire layer of a multi-layered wire structure, without a process such as polishing deteriorating the yield of a product. CONSTITUTION: A multi-layered wire structure includes a bottom wire layer(103a), an intermediate insulation layer, a filling layer(106,112), a top wire layer(109a) and a plated layer(113). The bottom wired layer is formed on a lead frame through an insulation layer. The intermediate insulation layer is formed on the bottom wire layer and has a via hole in a fixed region so as to reveal a top part of the bottom wire layer. The filling layer is made of a conductive material and the via hole fills with the conductive material. The top wire layer is formed on the intermediate insulation layer and has an opening unit on a top part of the region where the via hole is formed. The plated layer is formed on the top wire layer and is connected to the filling layer. |
