| 摘要 |
PROBLEM TO BE SOLVED: To make thin an electronic equipment having a jack mounted thereon, by reducing a mounting height of the jack to a mounting board. SOLUTION: The mounting mechanism includes a jack 1 and a mounting board 2. The jack has a jack main body 3 provided therein with a plug insertion hole 4 for insertion of a plug, support pieces 7 and connection terminals 6 projected from the main body 3. The board 2 has a jack mounting part 12 by which the jack 1 is mounted to the board as extended from one side of the board to the other side and also has connection parts 13 provided on one side, to which the connection terminals 6 projected from the jack 1 are connected. The jack 1 is mounted to the jack mounting part 12 as extended from one side face of the board 2 along the other side face thereof so that the support pieces 7 are extruded to one side face of the board 2 and the connection terminals 6 are connected to the connection parts 13.
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