发明名称 LAYING METHOD FOR WIRING AND PIPING MATERIAL, LAYING SHOOTER, LAYING LINKING APPLIANCE AND LAYING SPLITTING APPLIANCE
摘要 <p>PROBLEM TO BE SOLVED: To lay wiring and piping materials on a laying line stretching over a long distance easily and with a good workability. SOLUTION: By producing a pressure difference of air A inside a hollow cylindrical shooter 3 arranged continuously along a wiring/piping material laying route, a sending-out substance 11 to which a long rope 12 has been connected is sent into the shooter 3, and the long rope 12 is laid in the shooter 3. Then, the long rope 12 is pulled back and wiring/piping materials are laid along the laying route directly or through a pulling-in rope for pulling wiring/piping materials in.</p>
申请公布号 JP2000115936(A) 申请公布日期 2000.04.21
申请号 JP19980286966 申请日期 1998.10.08
申请人 MIRAI IND CO LTD 发明人 SHIMIZU SHOHACHI
分类号 H02G1/06;H02G1/08;(IPC1-7):H02G1/06 主分类号 H02G1/06
代理机构 代理人
主权项
地址
您可能感兴趣的专利