| 摘要 |
PROBLEM TO BE SOLVED: To clean an inspection needle without damaging the inspection needle in a semiconductor inspection device having the inspection needle for measuring an electric characteristic of a semiconductor wafer. SOLUTION: A semiconductor inspection device has a stage 1 three- dimensionally moved by sucking a semiconductor wafer and an inspection needle 5 contacted with the upper semiconductor wafer according to the rise of this stage 1. A cleaning means W contacted with the tip of the inspection needle 5 and a drying means 4 for drying the tip of the inspection needle 5 are arranged in one moving directional side part running in the surface direction of the stage 1.
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