发明名称 |
Thermal conditioning apparatus |
摘要 |
A wafer support including a plate having a top surface and a lift element opening extending trough said plate. The support also includes a support member adjacent the top surface having a proximal end, a distal end and a bore from the proximal to the distal end and a vacuum source in communication with the bore. The support furthermore includes a lift element having a contacting end disposed through the lift element opening and a drive coupled to at least one of the plate and the lift element.
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申请公布号 |
US6051074(A) |
申请公布日期 |
2000.04.18 |
申请号 |
US19990250071 |
申请日期 |
1999.02.12 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
STRODTBECK, TIMOTHY A.;MOLEBASH, JOHN S.;HAYES, BRUCE L.;SMITH, REX A.;DAVIS, SHAWN D. |
分类号 |
B25B11/00;H01L21/00;H01L21/687;(IPC1-7):C23C16/00;C23C14/00;C23F1/02 |
主分类号 |
B25B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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