发明名称 PLATING METHOD FOR USING ANODE COMPARTMENT ATTACHED TO INSOLUBLE ANODE AND ITS DEVICE
摘要 PROBLEM TO BE SOLVED: To provide the plating method and plating device for conducting plating at a high current density and a high speed at the time of continuously electroplating a long strip-shaped metallic sheet by the use of an insoluble anode by replenishing a large amt. of the plating metal ion consumed in plating in a short time with a simple device. SOLUTION: An anode compartment 1 attached to an insoluble anode isolated from a bulk plating soln. by a diaphragm 3 is provided in a plating tank 10, a dissolution tank 40 is furnished outside the plating tank, a plating soln. is circulated between the anode compartment 1 and dissolution tank 40, the plating soln. lowered in pH by the electrolysis in the anode compartment 1 is sent to the dissolution tank 40, the plating metal is dissolved in the plating soln. with the solubility improved by the lowering of pH, then the plating soln. is supplied to the anode compartment 1 for anodization, and the process is repeated.
申请公布号 JP2000109998(A) 申请公布日期 2000.04.18
申请号 JP19980281260 申请日期 1998.10.02
申请人 TOYO KOHAN CO LTD 发明人 FUJIMOTO TERUNORI;TAYA SHINICHI;SHIMIZU NOBUYOSHI
分类号 C25D3/12;C25D3/56;C25D17/00;C25D17/12;C25D21/14;(IPC1-7):C25D17/00 主分类号 C25D3/12
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