APPARATUS FOR MEASURING WAFER RESISTANCE/THICKNESS

摘要

PURPOSE: An apparatus reduces the measuring time by installing a plurality of probes in order to enable to measure the resistances and thickness of many points at a time. CONSTITUTION: An apparatus comprises: a stage which changes the position of a wafer(20) and where the wafer to be measured is placed; a plurality of probes(22) having a plurality of contact points and supplying current by being contacted with the wafer and measuring the voltage; and an arithmetic calculation tool calculating the sheet resistance and the thickness of the wafer by the current supplied to the wafer and the voltage across both ends of the probe. In order to measure many points, an electric circuit is additionally attached to each probe, and the probe can be arranged in a horizontal, or vertical direction and also in a cross as to a bar(24).