| 摘要 |
<p>The manufacturing method comprises: (a) a process of feeding a printing stage having a porous member (2) permeable in the direction of thickness; (b) a process of placing a plate (1) for circuit board having pierced holes (6) above said porous member (2); and (c) a process of filling a conductive material (5) in said pierced holes (6) from the upper side of said plate (1) for circuit board by sucking said porous member (2) at prescribed vacuum pressure from the back side of said porous member (2). Said porous member (2) has a porous plate (8) permeable in the direction of thickness and a porous sheet (9) permeable in the direction of thickness placed on said porous plate (8), and said plate (1) is placed on the upper side of said porous sheet (9). Said porous sheet (9) is replaceable and, moreover, a process of replacing said porous sheet is provided. Said porous sheet (9) contains cellulose in the range of approximately 90 wt.% to approximately 98 wt.%, and said cellulose contains softwood kraft pulp in the range of approximately 20 wt.% to approximately 40 wt.% and hardwood kraft pulp in the range of approximately 60 wt.% to approximately 80 wt.%.</p> |
