| 摘要 |
PCT No. PCT/JP97/02605 Sec. 371 Date Jan. 29, 1999 Sec. 102(e) Date Jan. 29, 1999 PCT Filed Jul. 28, 1997 PCT Pub. No. WO98/04959 PCT Pub. Date Feb. 5, 1998A negative-working photoresist composition comprising 1,4-dihydropyridine derivative as a photosensitive material and a polyamic acid, a heat-resisting photoresist composition comprising a photosensitive polyamic acid which is excellent in sensitivity and resolution and can be easily developed with an aqueous alkali solution is provided. The negative-working photoresist composition contains a polyamic acid and a 1,4-dihydropyridine derivative represented by following formula (I): wherein Ar represents an aromatic group having a nitro group at the ortho-position; R1 represents an alkylene group having from 1 to 5 carbon atoms; and R2, R3, R4, and R5 each represents a hydrogen atom or an alkyl group having from 1 to 4 carbon atoms.
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