发明名称 |
Hermetically sealed tungsten-copper composite package container for packaging of microwave devices |
摘要 |
A method for fabricating a hermetically sealed tungsten-copper package container for a microwave device is provided with the steps of forming an injection feedstock by mixing a polymer binder with a tungsten powder having a particle diameter of 2 to 5 mu m and a purity 99.9 of weight percent, forming a three-dimensional part by applying a powder injection molding to the feedstock, obtaining a tungsten skeleton structure by eliminating the binder from the injection molded part, and carrying out a copper infiltration to a copper plate placed on the tungsten skeleton structure for two hours under a hydrogen atmosphere at a temperature of 1250 DEG C. The method incorporates an improved heat sink characteristic, a thermal expansion coefficient similar to that of GaAs, and a capability of applying thereto a strip wire connection, without an extra machining process.
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申请公布号 |
US6049127(A) |
申请公布日期 |
2000.04.11 |
申请号 |
US19980096740 |
申请日期 |
1998.06.12 |
申请人 |
KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
YOO, MYOUNG KI;PARK, JONG KU;HONG, KYUNG TAE;KIM, YOUNG DO;LEE, SEUNG ICK;LEE, SEUNG WOO;CHOI, JU |
分类号 |
H01L23/02;H01L23/10;H01L23/66;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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